In 2018 we started exploring a next generation processor design with a more explicit target to reduce on-going maintenance requirements for long term fixed install scenarios.
One issue with the previous generation product was a poor airflow design with filters that clog frequently in dusty environments. We explored concepts borrowed from modern laptops, using heat pipes to move heat from the primary generators to a heatsink placed outside the chassis.
Dual hot-swap power supply units are often requested from clients, even though the PSUs we typically select have some of the longest MTBF of any component in the device and are the most trouble-free. In this design sketch the hot swap PSU are isolated in their own chamber in case forced air cooling is desired for the PSU section.
To speed development turnaround, we also started augmenting rapid prototyping with photo-realistic renderings instead of the typical shaded CAD models available at this stage. This allows us to get a better feel for how the equipment will combine with other components in a system. This illustration is an example of a glass/wireframe look to bring attention to the new component.